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Graphite-board
- Product Details
-
Graphite Board Applications include
★ Aerospace: Hot isostatic process furnaces, heat treating, sintering, brazing furnaces, autoclaves.
★ Semi conductors: Silicon pullers, gallium arsenate producers, furnaces.
★ Metalizing (metal heat treating): Heat treating furnaces, sintering, brazing furnaces.
★ Fibers manufacturing: Carbonizing furnaces, graphitizing furnaces - induction or resistance tube furnaces.★ Ceramics: Pyro lytic depositing furnaces, CVD furnaces
★ Quartz/Fused Silica manufacturing: Melting/Sintering furnaces.
★ Float glass industry: Insulating fasteners (part of liners).
★ Tool manufacturing: Sintering and hot pressing.
★ OEM - Furnace manufacturing: Hig h temperature furnaces.
★ Universities and Government Research Centers: High temperature furnaces, fuel cells.★ The material is formed by inteerating graphite foil, carbon felt and carbon cloth, and then qubjecping then to secondary high temperature purification treatment. The material is superior in ablation resistance performance, thermal shock resistance performance, airflow washing proof performance and thermal insulation performance. It is mainly used for vacuum high pressure air quenching furnace, low pressure fritting furnace, pressurization vacuum sintering furnace etc.
Type
★ Combines graphite felt with graphite foil
★ It is usually two sides of graphite foil or graphite cloth inner with graphite felt also 5 layers of graphite foil with layers of graphite felt or as per requests Surface with graphite paper, inner with graphite cloth and graphite feltTechnical Specification
GRADE
JP-PA
with foil
with CFC
Bulk Density(g/m3)
0.16—0.20
0.18—0.20
Ash (ppm )
300 (max)
Thermal Conductivity(W/m - k)
0.28
Electric Resistance(Qmm2/m)
35—45
Process Temperature(°C)
2300
Operation Temperature
InAir(°C)
<400
Vacuum(°C)
<2200
Inert Gas(°C)
<3400
Standard size(mm)
1500 x 1000x40
Length(mm)
1500—1700
Width(mm)
1000—1250
Thickness(mm)
20—240
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